NVIDIA has updated the production roadmap for the "Blackwell" architecture to include more intricate packaging.
15/01/2025
Industry analyst Ming-Chi Kuo reveals NVIDIA's restructuring of its "Blackwell" architecture roadmap to focus on dual-die designs with CoWoS-L packaging technology, eliminating single-die products and shifting manufacturing strategy towards the 200 Series, with plans for dual-die and single-die options in the 300 Series by 2026.